This paper presents an optimized curing process for the shear strength achievement and retention for anisotropic conductive adhesive (ACA) flip-chip interconnections. The curing kinetics of ACA is first presented and then a curing degree (α) relationship between curing temperature T and curing time t is established. The influence of different curing degree states on the interfa... https://foldlyers.shop/product-category/general-speakers/